Giesecke+Devrient Mobile Security (G+D) has unveiled its new market ready Integrated SIM (iSIM) solution for the IoT based on a module by Telit Cinterion.
With its iSIM operating system for a chipset from Sony Sony, G+D believes it’s now providing a solution specifically designed and optimised for use in NB-IoT (Narrowband IoT) applications.
The iSIM is central to improving the connectivity, security and sustainability of next-generation IoT devices. G+D wants to accelerate its iSIM innovation and therefore, in cooperation with Telit Cinterion, believes it has developed a new solution ideal for a wide range of NB-IoT use cases such as smart metering, smart agriculture, asset tracking and more.
A key component of the solution is the iSIM or iUICC (integrated universal integrated circuit card), which, unlike pluggable SIM cards or permanently soldered eSIMs, is a tamper-resistant element (TRE) within a system-on-a-chip (SoC).
This means that the iSIM is an isolated hardware component combined with a baseband chipset to form a single connectivity module. This design gives the iSIM numerous advantages in areas such as power consumption, cost, sustainability and security. The small footprint enables the production of small, lightweight and therefore cost-effective devices. In addition, iSIMs meet high sustainability requirements.
The isolated hardware, combined with G+D’s secure and certified iSIM operating system, ensures a high level of security. With the participation of a global tier-one global network operator, G+D insists it has successfully qualified its iSIM-OS on the Telit Cinterion NE310L2 NB-IoT module, based on Sony’s Altair ALT1255 chipset, and can now be offered to OEMs.
This marks a first milestone for G+D, as one of the first providers of an operating system for Sony’s low-power, cost-optimised Altair chipset that is specifically tailored to NB-IoT use cases.
G+D’s iSIM-OS is platform-independent and ensures optimal functionality on various iSIM-enabled chipsets, including Sony’s next-generations Altair ALT1250, ALT1255 and ALT1350 LTE-M and NB-IoT chipsets.
“G+D is investing heavily in the research and development of iSIM technology,” said BeeGek Lim, Global Vice President, Head of Business Line Digital Offerings at G+D. “In close cooperation with industry partners, we want to drive iSIM innovation forward.
“The successful development and qualification of an optimised iSIM-OS for a cost-effective and commercially available NB-IoT product is a perfect example of this in action.
“In general, one of our main priorities is to provide secure solutions for a wide range of IoT applications and devices, so that users can realise the full potential of the IoT with flexible and cost-optimised connectivity.”
“Telit Cinterion is happy to be part of the co-operation between G+D and Sony Semiconductor Israel on this first innovative technology achievement,” said Jose Sanchez, Senior Director Product Management, IoT Connectivity & Services at Telit Cinterion. “We look forward to working with our partners to stay at the forefront of iSIM technology for IoT in the coming years.”
“We are excited to collaborate with Telit Cinterion and G+D to enable iSIM on our LPWA products. ALT1255 is the first NB-IoT chipset on the market with iSIM”, said Dima Feldman, VP Product Management and Marketing at Sony Semiconductor Israel. “iSIM enables connectivity without additional physical hardware, which simplifies the solution and logistical onboarding flow and making it more affordable which is a key for the industrial IoT market”.
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