Teledyne FLIR has announced the next-generation embedded software for the ITAR-free Boson+ thermal camera module, delivering high performing uncooled thermal imaging technology for defence, firefighting, automotive, security, and surveillance applications.

Featuring thermal sensitivity of ≤20 mK, FLIR states that the Boson+ has been upgraded to provide even sharper thermal imagery and improved spatial filtering.

“Boson+ shares the industry-leading size, weight, and power (SWaP) of the widely deployed and real-world-proven Boson thermal camera module, simplifying integration and shortening time to market for our customers,” said Dan Walker, vice president, product management, OEM cores, Teledyne FLIR. “With software updates including new colour palettes, low gain mode, and an updated GUI, the AI-ready Boson+ continues to be the go-to thermal module for defence, industrial, and commercial integrators.”

Boson+ interfaces with the new Teledyne FLIR AVP, an advanced video processor that powers Prism™ AI and computational imaging at the edge.

The AVP, built on the latest Qualcomm QCS8550, efficiently runs Teledyne FLIR Prism AI software providing detection, classification, and target tracking.

To improve data fidelity and enhance decision support, it also operates Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilisation, local-contrast enhancement and noise reduction.

Made in the USA, the 12-micron pixel pitch Boson+ is available in both 320 x 256 and 640 x 512 resolutions. The noise equivalent differential temperature (NEDT) of 20 mK or less offers significantly enhanced detection, recognition and identification (DRI) performance. Improved video latency enhances tracking, seeker performance, and decision support.

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