Teledyne FLIR OEM and Sonim Technologies unveiled its Thermal by FLIR collaboration – bringing professional thermal imaging to the smartphone with the XP Pro Thermal.
It features an integrated FLIR Lepton radiometric thermal camera module and the advanced MyFLIR Pro app, setting a new standard for field-ready mobile devices.
Designed for professionals who demand ultimate reliability in challenging environments, the XP Pro Thermal combines Sonim’s legendary rugged engineering with cutting-edge thermal capabilities.
The device leverages the Qualcomm Snapdragon 7 Gen 3 processor to deliver exceptional performance and introduces game-changing features, including Teledyne FLIR’s patented MSX technology, which overlays visible-light details onto thermal images for unprecedented clarity and context.
Users can also access FLIR Thermal Studio software, enabling comprehensive inspection workflows and sophisticated data analysis for professional reporting.
“The Sonim XP Pro Thermal represents a new phase in our ruggedised handset development. With the Lepton 3.5 and mobile software development kit (SDK), we’ve created the ultimate carrier-adoption-ready rugged device,” said Michael Coad, senior vice president, product-phones, Sonim Technologies. “The Thermal by FLIR collaboration has been instrumental in rapidly bringing this innovative solution to market, delivering the combination of 5G and advanced thermal capabilities our customers need for enhanced situational awareness and decision making.”
“Sonim has engineered a consumer-sized platform that transforms how industrial professionals capture and process critical inspection data,” said Mike Walters, vice president, product development, Teledyne FLIR OEM. “As the thinnest rugged smartphone with Teledyne FLIR OEM professional-grade thermal capabilities, the XP Pro Thermal will transform expectations for rugged mobile devices.”
A thermal-capable ruggedised mobile phone first, Sonim’s XP Pro Thermal is carrier-adoption ready, making it more accessible for professionals and consumers alike than ever before.
Furthermore, its size and form factor make the XP Pro Thermal the world’s thinnest ultra-rugged smartphone featuring a FLIR Lepton camera module while still delivering all the protection from the elements professionals expect.
Through the Thermal by FLIR program, collaborators gain access to advanced thermal imaging technology, accelerated development support, and comprehensive go-to-market assistance. This innovative program helps manufacturers integrate Teledyne FLIR OEM thermal camera modules while minimizing development costs and speeding the time to market.
For detailed information about the Lepton module, click here. To learn more about collaboration opportunities, visit the Thermal by FLIR page. Discover Sonim’s complete range of rugged solutions at www.sonimtech.com.
Available from carriers and distributors in Europe and South Africa in the coming months, the XP Pro Thermal will launch in other markets later in 2025. Experience this revolutionary device firsthand at the Teledyne FLIR booth #7B6 during Mobile World Congress (MWC) in Barcelona, Spain, March 3-6, 2025.
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